next generation computer

Someone in new just bought

Next generation computer

ago

Free Shipping This Week Order Over - $150


Description

Construction of the power supply section 10+2+1
Cooling of the power supply section with a heat sink Yes (Fully cooled power section with aluminum heatsink)
Motherboard chipset cooling type Passive
Supported processor families AMD Ryzen™
CPU socket Socket AM4
Chipset AMD B550
Processor architecture Zen 2 (3rd generation)
Zen 3 (4th generation)
Type of memory supported DDR4-3200MHz
DDR4-3066MHz
DDR4-3000MHz
DDR4-2933MHz
DDR4-2800MHz
DDR4-2666MHz
DDR4-2400MHz
DDR4-2133MHz
DDR4-1866MHz
Type of supported OC memory DDR4-5100MHz
DDR4-5000MHz
DDR4-4866MHz
DDR4-4800MHz
DDR4-4733MHz
DDR4-4600MHz
DDR4-4533MHz
DDR4-4400MHz
DDR4-4266MHz
DDR4-4133MHz
DDR4-4000MHz
DDR4-3866MHz
DDR4-3733MHz
DDR4-3600MHz
DDR4-3466MHz
DDR4-3200MHz
DDR4-3066MHz
DDR4-3000MHz
DDR4-2933MHz
DDR4-2800MHz
DDR4-2666MHz
Number of memory banks 4 x DIMMs
Maximum RAM size 128 GB
Memory architecture Dual-channel
Internal connectors SATA III (6 Gb/s) - 6 pcs.
M.2 PCIe NVMe 4.0 x4 / SATA - 1 pc.
M.2 PCIe NVMe 3.0 x4 - 1 pc.
PCIe 4.0/3.0 x16 - 1 pc.
PCIe 3.0 x16 (x4 mode) - 1 pc.
PCIe 3.0 x1 - 2 pcs.
USB 3.2 Gen. 1 Type-C - 1 pc.
USB 3.2 Gen. 1 - 1 pc.
USB 2.0 - 2 pcs.
ARGB 3 pin connector - 2 pcs.
RGB 4 pin connector - 2 pcs.
Front Panel Audio
CPU fan connector 4 pin - 1 pc.
SYS/CHA fan connector - 6 pcs.
AIO pump connector - 1 pc.
Power connector 8 pin - 1 pc.
24 pin power connector - 1 pc.
TPM module connector - 1 pc.
External connectors HDMI - 1 pc.
DisplayPort - 1 pc.
RJ45 (LAN) 2.5 Gbps - 1 pc.
USB Type-C - 1 pc.
USB 3.2 Gen. 1 - 2 pcs.
USB 3.2 Gen. 2 - 1 pc.
USB 2.0 - 2 pcs.
PS/2 keyboard/mouse - 1 pc.
Audio jack - 5 pcs.
S/PDIF - 1 pc.
Wi-Fi antenna connector - 2 pcs.
Flash BIOS Button - 1 pc.
RAID support RAID 0
RAID 1
RAID 10
Multiple graphics card support AMD CrossFireX

testimonial

alan doe

Dawid Olko

CEO & Founder Invision

quotation

Empowering your digital world, one byte at a time. Welcome to TechByte, where innovation meets excellence.